Foro de elhacker.net

Buenas noches:

Necesito saber si alguien a podido modificar y volver a escribir datos de las memorias windbond como por ejemplo la mac y numero de serie de un equipo

Posible leer y escribir lo que no te puedo decir si la informacion puedas modificarla asi por que si puede que este cifrada y a parte tengas problemas de check sum



X   Family Descriptor   25P = spiFlash serial flash memory
25Q = spiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
25X, 25D = spiFlash serial flash memory with 4kB sectors, dual outputs
25B = spiFlash serial flash memory with boot and parameter sectors
XXX   Density   10, 10A, 10B, 10C = 1Mbit
20, 20A, 20B, 20C = 2Mbit
40, 40A, 40B, 40C = 4Mbit
80, 80A, 80B = 8Mbit
16, 16A, 16B, 16C, 16D = 16Mbit
32, 32A, 32B, 32D, 32F = 32Mbit
64, 64B, 64C, 64D, 64F = 64Mbit
128B, 128F = 128Mbit
256F = 256Mbit
X   Supply Voltage   L = 2.3V to 3.3V
V = 2.7V to 3.6V
W = 1.65V to 1.95V
XX   Package Type   DA = PDIP8 300mil
SN = SOIC8 150mil
SS = SOIC8 200mil
SF = SOIC16 300mil
ZP = WSON8 6x5mm
ZE = WSON8 8x6mm
UX = 8-pad USON 2x3mm
B = TFBGA24 8x6mm (5x5 ball array) (W25Q128FV)
C = TFBGA24 8x6mm (6x4 ball array) (W25Q128/256FV)
E = WSON8 8x6mm (W25Q128/256FV)
F = SOIC16 300mil (W25Q128/256FV)
P = WSON8 6x5mm (W25Q128FV)
S = SOIC8 200mil (W25Q128FV)
SV = VSOP8 150mil
ST, T = VSOP8 208mil
TB = 24-ball TFBGA 8x6mm (5x5-1 ball array)
TC = 24-ball TFBGA 8x6mm (6x4 ball array)
X   Temperature Range   C = Commercial (0°C to 70°C)
I = Industrial (-40°C to 85°C)
X   Special Options   Blank = Standard
G = Green package (Lead-free, RoHS compliant, Halogen-free (TBBA),
Antimony-Oxide-free Sb203)
Z = Lead free (Lead-free, RoHS compliant)
1 = One time program (OTP) enabled
P = Green Package with Status Register Power-Down & OTP enabled
Q = Green Package with QE=1 in Status Register-2
M = Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA),
Antimony-Oxide-free SB2O3) & optimized for mobile applications